BS-4060NIR near-infrared industrial microscope imaging system is leading industrial infrared inspection equipment, providing efficient industrial testing solutions for customers. Industrial infrared microscopy imaging systems can observe the interior of packaged chips and wafers in real time.

BS-4060NIR has wide-field illumination, area array detection to achieve wide spectrum, large field of view and high-resolution imaging. Real-time imaging and observation of packaged chips and the interior of wafers provide users with clearer ultra-wide spectrum imaging. The infrared band (900-1700nm) has a wide spectral range, small scattering and strong penetration into silicon wafers (Germanium wafers). The large numerical aperture objective lens (with correction ring) can eliminate aberrations caused by difference in overlay thickness, achieving effective and accurate infrared detection. Ergonomics design provides users with the highest working efficiency.

1.Widespectrum dedicated infrared camera

BS-4060NIR uses a wide spectrum dedicated infrared camera, covering bright field and infrared observation, for field illumination, wide imaging field and infrared observation. Field illumination, wide imaging field of view and high resolution. With bandpass color filter for area array detection, it can respond to different parts of the chip inside the silicon wafer to meet the needs of different customers.

3.2 mega pixel

 1.3mega pixel

2.Epi-illuminator

The optical elements in illuminators are enhanced transparency in the 400-1700nm band. There are bright field and infrared field for selection. Wide spectral range, small scattering and strong penetrability to silicon wafers (Germanium sheet).

Automatic matching of aperture diaphragm and objective magnification, no need for manual adjustment, it is faster and more efficient for different users to have the same observation effect.

3.Special infrared objective lens

BS-4060NIR industrial infrared microscope imaging system is equipped with 5X-50X professional infrared objectives that provide aberration correction from visible to near-infrared wavelengths, suitable for conventional bright field and dedicated infrared observation.

For high magnification objectives with larger numerical apertures, a correction ring is added to correct aberrations caused by difference in overlay thickness, to enable high-definition and accurate detection in the near-infrared band.

Infrared objective lens transmittance curve

4.Multi-hole filter slider

Multi-hole filter sliders, there are 1100nm, 1200nm, 1300nm bandpass near-infrared color filters for option. Users can quickly switch bands. By narrow-bandwidth secondary filtering to achieve responses of different structures, high-definition images can be obtained.

5.Large mechanical stage

BS-4060NIR industrial infrared microscope imaging system uses a clutch button. The users can flexibly move the stage by pressing the clutch button, without the need for prolonged gripping of the handle, and press the clutch button to cancel the quick move. Free the hands of users during long-term operation and speed up observation. The stage has precision rail mechanism, which makes the movement lighter and smoother, and the product more stable and reliable.

The stage is 12*14inch mechanical stage with a dimension of 420mm*710mm. The moving range is 305mm*356mm.

6.Safe, high speed motorized nosepiece

Equipped with forward and backward moving modes to quickly and accurately locate the required magnification objective with high precision in repeated positioning. Mechanical switching mode effectively improves the working life of the nosepiece.

7.Software with more operating functions

In addition to functional modules such as management, measurement, image collection, and layer management, additional with the unique infrared image enhancement function, automatic detection functions can also be specified according to customer needs.

Image enhancement

Improve the image clarity of infrared penetration, making local details more obvious.

AI software empowerment

AI Self-learning function can be performed based on the defects of the samples, automatic defect identification, capture, counting statistics and other functions. Also, customization can be made according to the needs of different customers.

Non-destructive inspection for CSP/SIP

Non-destructive analysis of bad chip packaging

Near infrared detection of MEMS devices

Note: ● Standard Outfit, ○ Optional

Unit: mm